SPECIALTY SERVICES MATERIALS Monocrystaline Silicon (CZ, FZ) (Prime, Test, Optical, etc.) Small or Large orders Special Materials OD GRINDING & FLATING 2"-6.5" Diameter Material Flat Orientation - semi-standard or better Flat Specifications - any Tight Flat - orientation Add or Locate a Flat WAFER SLICING 1"-6.5" Thick or Thin wafer slicing Shapes - open Tight Wafer Orientation - ON or OFF Tight Bow/Warp and TTV Small or Large Lots (high yields) EDGE GRIND 4"-6" Semi-Standard SOI Bonded Recovery of Out-of-Spec diameters Secondary flats added Jeida to semi-flat recovery Cut-Downs (laser, other) LAPPING/POLISHING We work with well-established companies for lapping/polishing services to provide our customers a "one-stop-shop" SEED FABRICATION Special orders LASER CUTDOWNS Any Size Services